Patent · US Expired

Optical element-mounting substrate and method of producing the same

US6934448B2 · kind B2 · utility

11Cited by
6References
27Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 4, 2002
Grant dateAug 23, 2005
Priority date
Expiry dateDec 4, 2022

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01S5/0683
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

An optical element-mounting substrate that makes it easy to optically couple the optical semiconductor element to the optical fiber or to the lens and that can be highly integrated while suppressing deterioration in the high-frequency signals. The optical element-mounting substrate for optically coupling the optical semiconductor element to the optical fiber through the lens, comprises an insulating film formed on the surface of the optical element-mounting substrate, grooves formed on the substrate for installing the optical fiber and the lens, a thin-film electrode formed on the insulating film, a thin-film capacitor and a thin-film temperature sensor arranged maintaining a distance from the thin-film electrode, and a solder film formed on the insulating film in a region where the optical semiconductor element is mounted so as to be electrically connected to the thin-film electrode.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.