Apparatus and method for precise lapping of recessed and protruding elements in a workpiece
US6935013B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2000 |
| Grant date | Aug 30, 2005 |
| Priority date | — |
| Expiry date | May 27, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53165
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lapping method utilizing textured and conditioned lapping plates most suitable for finishing magnetic heads resulting in improved surface quality, less sensitivity to electrical shorts due to smears, and reduced surface height difference between the head elements exposed at the slider air bearing surface. A rough lapping phase is followed by a polishing phase that maintains the same mechanical motion between the work piece and lapping plate but utilizes only the lapping plate without abrasives of any kind to polish the work piece surface, and to clean up any deep textured marks resulting from the diamond slurry phase. A conductive liquid is utilized to provide lubrication and to minimize static charge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.