Gap gauge
US6935038B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2002 |
| Grant date | Aug 30, 2005 |
| Priority date | — |
| Expiry date | Feb 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67259
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for preventing damage to a chamber wall by a baffle plate in a semiconductor fabrication system during a semiconductor fabrication operation is disclosed herein. An electrostatic chuck is associated with the semiconductor fabrication system. A gauge for measuring a gap between said baffle plate and the chamber wall can be utilized to prevent damage to the chamber wall by the baffle plate during a movement of the electrostatic chunk during the semiconductor fabrication operation. Such a semiconductor fabrication operation can comprise, for example, a wet cleaning semiconductor operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.