Heat sink apparatus with air duct
US6935419B2 · kind B2 · utility
24Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2002 |
| Grant date | Aug 30, 2005 |
| Priority date | — |
| Expiry date | Apr 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipating apparatus. In one embodiment, a heat dissipating apparatus is comprised of a heat sink device having a plurality of cooling fins coupled to the heat sink device. The heat sink device is adapted to be thermally coupled to a heat source. The plurality of cooling fins are adapted to dissipate heat generated by the heat source. An air duct is coupled with the heat sink device. The air duct is for directing an airflow to the cooling fins to increase dissipation of the heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.