Encapsulation of organic electronic devices using adsorbent loaded adhesives
US6936131B2 · kind B2 · utility
63Cited by
15References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2002 |
| Grant date | Aug 30, 2005 |
| Priority date | — |
| Expiry date | Dec 5, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
Abstract
Disclosed herein are organic electronic devices that are encapsulated at least in part by adsorbent-loaded transfer adhesives. The adsorbent material may be a dessicant and/or a getterer. The adsorbent-loaded transfer adhesive may form a gasket around the periphery of the device, or may cover the entire device and its periphery. An encapsulating lid covers the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.