Methods for patterning using liquid embossing
US6936181B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2002 |
| Grant date | Aug 30, 2005 |
| Priority date | — |
| Expiry date | Mar 20, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/13
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The current invention is directed to a method of patterning a surface or layer in the fabrication of a micro-device. In accordance with a preferred embodiment of the invention, a first mask structure is formed by depositing a layer of a first material onto the surface or layer and embossing the layer with a micro-stamp structure. The layer is preferably embossed as a liquid, which is solidified or cured to form the first mask structure. The first mask structure can be used as an etch-stop mask which is removed in a subsequent processing step or, alternatively, the first mask structure can remain a functional layer of the micro-device. In further embodiments, unmasked regions of the surface or layer are chemically treated through the first mask structure and/or a second material is deposited onto the unmasked regions of the surface or layer through the first mask structure to form a second mask structure and/or a second functional layer of the micro-device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.