Metal/ceramic circuit board
US6936337B2 · kind B2 · utility
2Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2003 |
| Grant date | Aug 30, 2005 |
| Priority date | — |
| Expiry date | Dec 24, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate 10, and a metal circuit plate (a copper plate 14) bonded to the ceramic substrate 10, the metal circuit plate having a thickness which is more than 0.25 mm and which is less than 0.3 mm, and the metal circuit plate having a skirt spreading length (a dimensional difference between the bottom and top portion of the peripheral edge portion of the metal circuit plate) of less than 50 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.