Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof
US6936525B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2002 |
| Grant date | Aug 30, 2005 |
| Priority date | — |
| Expiry date | Sep 13, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing the semiconductor chips comprises the steps of: pasting on a substrate an adhesive sheet having a property to retain its adhesive strength prior to a processing, then lose its adhesive strength after the processing; fixing a plurality of non-defective bare chips on this adhesive sheet, with their Al electrode pad surfaces facing down; coating a resin on a whole area other than the Al electrode pad surfaces of the plurality of non-defective bare chips including interspaces therebetween; applying a predetermined process to the adhesive sheet to weaken its adhesive strength of the adhesive sheet; peeling off a pseudo wafer bonding non-defective bare chips; and dicing the plurality of non-defective bare chips into a discrete non-defective electronic part by cutting the pseudo wafer at a position of the resin between respective non-defective bare chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.