Conductor-within-a-via microwave launch
US6937120B2 · kind B2 · utility
23Cited by
6References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2003 |
| Grant date | Aug 30, 2005 |
| Priority date | — |
| Expiry date | Jun 23, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10287
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A concentric ‘conductor within a via’ RF interconnect architecture, has an inner via through which at least one RF signal conductor passes. The inner conductive via is coaxially formed within and stably coaxially aligned within an outer conductive via, which serves as a coaxial ground plane that completely surrounds the inner conductive via. The outer conductive via passes through dielectric layers of microstrip or stripline structures on opposite sides of a multi printed circuit laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.