Printed wiring board
US6937480B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2002 |
| Grant date | Aug 30, 2005 |
| Priority date | — |
| Expiry date | Jan 25, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board is provided which can be applied even to circuit boards operating at high speed, and which can suppress electromagnetic wave radiation, and which can suppress a deterioration in density of mounting. At the printed wiring board, a first signal wire layer, a first ground layer having a first power source wire, a second ground layer having a second power source wire, and a second signal wire layer, are laminated. The first ground layer and the second ground layer are interlayer connected by many via holes. Return current, of signal current flowing through a signal wire, flows in the first ground layer, and a path of the return current is cut midway therealong at a position of the first power source wire. However, the return current is detoured by the via hole to the second ground layer, and flows thereat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.