Process, system, and kit for evaluating the relief of the skin with a substrate
US6937749B2 · kind B2 · utility
3Cited by
9References
39Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 15, 2002 |
| Grant date | Aug 30, 2005 |
| Priority date | — |
| Expiry date | Jan 6, 2023 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B5/1034
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A process, system, and kit for evaluating the relief of the skin using a substrate with an adhesive surface. The process includes the steps of applying the substrate onto a test zone of the skin so that the adhesive surface is in contact with the skin at contact locations; removing the substrate; and evaluating the image formed on the adhesive surface. The image results from the modification of the adhesive surface at the contact locations. In a preferred embodiment, the adhesive surface, when applied to the skin, is not in appreciable contact with the sunken zones of the skin, such as the wrinkles or lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.