Method for fabricating a filament affixed trace within an electronic device
US6938331B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2003 |
| Grant date | Sep 6, 2005 |
| Priority date | — |
| Expiry date | Nov 6, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a filament-affixed trace within an electronic device, such as a circuit board or microelectronic device. Conductive traces are affixed to the surface of a composite substrate containing filaments in a matrix bonded to an underlying solid material. The matrix is then removed, leaving the conductive traces suspended or supported by filaments. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.