Diffusion bonding method for microchannel plates
US6938817B2 · kind B2 · utility
2Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2004 |
| Grant date | Sep 6, 2005 |
| Priority date | — |
| Expiry date | Mar 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2231/5016
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A microchannel plate (MCP) (50) and a dielectric insulator (80) are deposited with a thin film (54, 84) using a suitable metal selected for optimum diffusion. The metallized MCP (50) and dielectric insulator (80) are then aligned and placed in a bonding fixture (36) that provides the necessary force applied to the components to initiate a diffusion bond. The bonding fixture (36) is then placed in a vacuum heat chamber to accelerate the diffusion bonding process between the MCP (50) and the dielectric insulator (80).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.