Paste for circuit connection, anisotropic conductive paste and uses thereof
US6939431B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 2, 2002 |
| Grant date | Sep 6, 2005 |
| Priority date | — |
| Expiry date | Feb 5, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P20/582
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and connection reliability at high temperatures and high humidity, and the ability to be repaired. The paste for circuit connection contains an epoxy resin, an acid anhydride curing agent or a phenolic curing agent, and high-softening point fine particles. The anisotropic conductive paste additionally contains conductive particles. The method of using the paste for circuit connection or the anisotropic conductive paste involves connecting an electric circuit wiring formed on a substrate with an electric circuit wiring formed on another substrate with the paste for circuit connection or the anisotropic conductive paste.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.