Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging
US6939473B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2003 |
| Grant date | Sep 6, 2005 |
| Priority date | — |
| Expiry date | Oct 20, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01C19/5719
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for making an angular velocity sensor having two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame provided. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly wafers provides a hermetic barrier between the masses and an ambient environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.