IC package, optical transmitter, and optical receiver
US6940155B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2002 |
| Grant date | Sep 6, 2005 |
| Priority date | — |
| Expiry date | May 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided an IC package provided with one or more bare chips mounted on a chip carrier, a plurality of first bumps each for connecting a chip electrode to a conductive pad disposed on an upper surface of the chip carrier, a plurality of second bumps each connected to a conductive pad disposed on a bottom surface of the chip carrier, and a plurality of vias for connecting between conductive pads disposed on the upper and bottom surfaces of the chip carrier. A differential pair of lines are exposed on the upper surface of the chip carrier. High-frequency signals to be processed by the one or more bare chips are transmitted by way of the differential pair of lines, and other signals are transmitted by way of the plurality of second bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.