Variable cross-section plated mushroom with stud for bumping
US6940167B2 · kind B2 · utility
4Cited by
8References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2004 |
| Grant date | Sep 6, 2005 |
| Priority date | — |
| Expiry date | Mar 19, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved bump fabrication process is described that produces a larger diameter/taller solder ball than with a standard mushroom by forming an elongated mushroom having a short axis in the direction of adjacent connection mushrooms and an elongated axis orthogonal to the short axis. The increased larger volume solder when reflowed produces the larger diameter/taller bolder ball bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.