Transponder
US6940455B2 · kind B2 · utility
21Cited by
4References
20Claims
0Family size
Inventor
Key dates
| Filing date | Mar 13, 2001 |
| Grant date | Sep 6, 2005 |
| Priority date | — |
| Expiry date | Jul 30, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A transponder comprising a chip having contact pads and at least two coupling elements, which are conductively connected with the contact pads, wherein the coupling elements are touch-free relative to each other and formed in a self-supported as well as free-standing way and are essentially extended parallel to the chip plane, the total mounting height of the transponder corresponds essentially to the mounting height of the chip, and the coupling elements are in geometry and size adapted for acting as a dipole antenna or in conjunction with an evaluation unit as a plate capacitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.