CPU cooling using a heat pipe assembly
US6940717B2 · kind B2 · utility
14Cited by
26References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 13, 2003 |
| Grant date | Sep 6, 2005 |
| Priority date | — |
| Expiry date | Nov 25, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A CPU cooling apparatus comprises a fin, a heat sink, and a heat pipe thermally coupling the fin and the heat sink. When installed in a personal computer, the fin thermally couples with a CPU to receive heat generated by the CPU. The heat pipe conducts the heat to a heat sink, which is cooled by an exhaust fan that directs a flow of air outside the computer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.