Uniform heat dissipating and cooling heat sink
US6942025B2 · kind B2 · utility
20Cited by
40References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2002 |
| Grant date | Sep 13, 2005 |
| Priority date | — |
| Expiry date | Nov 21, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A uniform heat dissipating and cooling heat sink for increasing conductive cooling at locations where conductive cooling and temperature differential is reduced. The heat sink includes a base having a variable thickness with a maximum thickness at the interior thereof and a plurality of fins upstanding from the base with adjacent fins separated by a flow channel having diverging sides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.