Apparatus and process for polishing a substrate
US6942554B1 · kind B1 · utility
10Cited by
9References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 21, 2003 |
| Grant date | Sep 13, 2005 |
| Priority date | — |
| Expiry date | Jul 21, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B13/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for polishing a substrate with an optical surface. The apparatus contains a polishing pad and and a device for oscillating the polishing pad while simultaneously contacting it with at least 90 percent of said optical surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.