Silver compound paste
US6942825B2 · kind B2 · utility
13Cited by
0References
3Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 31, 2002 |
| Grant date | Sep 13, 2005 |
| Priority date | — |
| Expiry date | Oct 31, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An object of the present invention is to provide a silver compound paste which can be easily applied without containing resin, and which produces a conductive film having a low electric resistivity by heating under conditions substantially equivalent to those in a conductive film containing a polymer type conductive paste. The present invention provides a silver compound paste containing silver oxide particles and a tertiary fatty acid silver salt.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.