Aqueous stripping and cleaning composition
US6943142B2 · kind B2 · utility
11Cited by
21References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2002 |
| Grant date | Sep 13, 2005 |
| Priority date | — |
| Expiry date | Jan 14, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to aqueous compositions used to remove post etch organic and inorganic residue as well polymeric residues and contaminants from semiconductor substrates. The compositions are comprised of a water soluble organic solvent, a sulfonic acid and water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.