Semiconductor device and manufacturing method for same
US6943433B2 · kind B2 · utility
105Cited by
11References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 13, 2002 |
| Grant date | Sep 13, 2005 |
| Priority date | — |
| Expiry date | Dec 13, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
To provide a light emitting device having a high reliability wherein no resin burrs occur, The semiconductor device comprises a semiconductor element, a package having a recess for housing the semiconductor element and a mold member for sealing the semiconductor element in the recess and the package comprises lead electrodes and a package support part supporting the lead electrodes so that main surfaces of the tip portions of the lead electrodes are exposed from the bottom surface of the recess.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.