EMI heatspreader/lid for integrated circuit packages
US6943436B2 · kind B2 · utility
28Cited by
38References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2003 |
| Grant date | Sep 13, 2005 |
| Priority date | — |
| Expiry date | Jan 15, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0218
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package includes a lid with EMI containment features. The lid may include a plurality of projections adapted to couple a ground plane of a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.