Electronic circuit device including metallic member having installation members
US6943443B2 · kind B2 · utility
13Cited by
12References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2002 |
| Grant date | Sep 13, 2005 |
| Priority date | — |
| Expiry date | May 1, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Bumps are formed on electrodes of semiconductor elements, and moreover, the semiconductor elements with the bumps are electrically connected to metallic members having installation members, whereby wiring lines are eliminated. Stray inductance and conduction resistance resulting from wiring lines can be reduced. A conventional dented connector and a projecting connector are eliminated by connecting the installation members to a second circuit board, thereby enabling an electronic circuit device of a power control system to be made compact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.