Heat sink mounting assembly
US6944026B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2004 |
| Grant date | Sep 13, 2005 |
| Priority date | — |
| Expiry date | Mar 11, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink mounting assembly includes a retention module (80) accommodating a heat sink (50) therein, and two retaining units (10) cooperating with the retention module to secure the heat sink therein. Each retaining unit includes a retaining clip (20) engaging with the retention module, and a pressing body (40) attached to the retaining clip. The pressing body includes a pressing portion (42) urging against the heat sink, and two releasing arms (46) each having a spring finger (48) snappingly engaging with the retaining clip when the pressing body is pressed toward the heat sink. When the releasing arms are squeezed, the spring fingers disengage from the retaining clip, and the pressing portion is released from the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.