Method for attaching a porous metal layer to a metal substrate

US6945448B2 · kind B2 · utility

Assignee

• Zimmer Technology, Inc. · US

Inventors

• Dana J. Medlin · Omaha, US
• Steven J. Charlebois · West Lafayette, US
• William Clarke · Rialto, US
• Dirk Pletcher · Walkerton, US
• Joel G. Scrafton · Syracuse, US
• H. Ravindranath Shetty · Warsaw, US
• Dale Frederick Swarts · Warsaw, US

Key dates

• Filing date: Jun 6, 2003
• Grant date: Sep 20, 2005
• Expiry date: Jun 6, 2023

Classification

• Technology area (CPC A): Human Necessities
• CPC primary: A61F2310/00544
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components or acetabular cups. The method, in one embodiment thereof, comprises providing a structured porous layer; providing a dense metal substrate; providing a binding mixture; applying the binding mixture to the exterior of the substrate; placing the porous layer against the substrate such that the binding mixture is disposed there between forming an assembly; and heat treating the assembly to metallurgically bond the porous layer to the substrate.