CMP formulations
US6945851B2 · kind B2 · utility
9Cited by
6References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2004 |
| Grant date | Sep 20, 2005 |
| Priority date | — |
| Expiry date | Apr 26, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
CMP formulations for use on nickel/phosphorus alloys comprising abrasive particles and an oxidant, a modifier for the action of the oxidant and first and second accelerants to sequester removed materials containing phosphonate and ammonium or amine groups respectively and optionally an organic carboxylic acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.