Thermal management materials
US6946190B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 13, 2003 |
| Grant date | Sep 20, 2005 |
| Priority date | — |
| Expiry date | May 13, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally-conductive compound for forming a layer which is conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The compound is an admixture of a thermal grease component and a dispersed constituent forming discrete domains within the grease component, the domains being form-stable at normal room temperature in a first phase and conformable between the first and second heat transfer surface in a second phase, and the domains having a domain transition temperature above normal room temperature from the first phase to the second phase. The dispersed constituent may be a fusible, i.e., low temperature melting, metal or metal alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.