FBAR based duplexer device and manufacturing method thereof
US6946320B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2004 |
| Grant date | Sep 20, 2005 |
| Priority date | — |
| Expiry date | Jan 12, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is an FBAR based duplexer device and a manufacturing method thereof, which can achieve miniaturization, and reduction of a manufacturing cost and enhancement of a yield due to a simplified process. According to the present invention, first, a plurality of FBAR chips are prepared. Each of the FBAR chips includes a substrate, air gaps and piezoelectric layer unit; which are successively arranged, a plurality of electrode pads electrically connected to the piezoelectric layer unit, and bump balls formed on the electrode pads in a one to one ratio. Then, a duplexer substrate having a duplexing circuit is prepared, and a plurality of the FBAR chips come into contact with the duplexer substrate. In this state, they are reversed so that the substrates of the FBAR chips face upward, and the bump balls are bonded to the duplexer substrate. After that, protective structures are formed by the use of a film, so as to be positioned on side surfaces as well as upper surface of the respective FBAR chips, and finally, a molding portion is formed so as to cover the protective structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.