Method and apparatus for forming high surface area material films and membranes
US6946362B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2002 |
| Grant date | Sep 20, 2005 |
| Priority date | — |
| Expiry date | Aug 25, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24612
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a method and apparatus for producing high surface area material films and membranes on substrates. In one application, patterns of spikes or bristles are produced on wafers and transferred to films, such as conductive polymer or metal films, by using repetitive and inexpensive processes, such as electroplating and embossing. Such a technique provides low cost, high surface area materials and allows reuse of expensive patterned silicon. Membranes with high surface area are extremely valuable in fuel cells since the power density is generally proportional to the surface area and the patterns may be used to cast inexpensive fuel cell electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.