Polyparaxylylene film, production method therefor and semiconductor device
US6946405B2 · kind B2 · utility
4Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2002 |
| Grant date | Sep 20, 2005 |
| Priority date | — |
| Expiry date | Jul 22, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An organic polymer film of low dielectric constant and high heating resistance which is applicable as an insulating layer of a semiconductor devices is provided, as well as a manufacturing method for the film and a semiconductor device incorporating the film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.