Polymer composition containing clean filler incorporated therein
US6946513B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2001 |
| Grant date | Sep 20, 2005 |
| Priority date | — |
| Expiry date | Nov 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There is provided an elastomer composition which is prepared by using a very clean filler reduced in both of an amount of moisture generation and an amount of organic outgas generation and is suitable as a molding material for semiconductor production apparatuses and there is provided a molded article. The composition is a crosslinkable composition comprising a high molecular weight polymer, particularly a crosslinkable fluorine-containing elastomer and a filler which has a weight reduction ratio per unit surface area of not more than 2.5×10−5% by weight/m2 when heating at 200° C. for two hours and a total amount of organic gas generated of not more than 2.5 ppm when heating at 200° C. for 15 minutes. The molded article is produced from the crosslinkable composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.