Hot melt adhesives
US6946528B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2002 |
| Grant date | Sep 20, 2005 |
| Priority date | — |
| Expiry date | Jan 18, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2822
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention provides a hot melt adhesive composition including a tubular reactor copolymer of ethylene and 5 to 20 mol % of comonomer units derived from an alkyl acrylate or alkyl methacrylate, wherein the copolymer has a melt index of at least 300 g/10 min. The alkyl group of the alkyl acrylate or alkyl methacrylate can be a linear or branched C1 to C12 group, particularly n-butyl. If desired, the hot melt adhesive can further include tackifiers, waxes, antioxidants and other desired additives. The hot melt adhesive composition shows improved heat resistance and favorable properties, such as has a shear adhesion fail temperature of at least 80° C., without the need to use high melting waxes. The invention further provides articles such as cartons, cases, trays, bookbindings or disposables including the hot melt adhesive compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.