System and methods for hermetic sealing of post media-filled MEMS package
US6946728B2 · kind B2 · utility
16Cited by
14References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2004 |
| Grant date | Sep 20, 2005 |
| Priority date | — |
| Expiry date | Feb 26, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0145
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
This invention provides a system and method for hermetically sealing a post media-filled package with a metal cap. The method can include the operation of filling a MEMS package through a fill port with at least one medium. A further operation can be plugging the fill port in the MEMS package with a sealant. Another operation can include depositing a metal cap over the sealant to hermetically seal the fill port.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.