Semiconductor device and its manufacturing method
US6946747B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2003 |
| Grant date | Sep 20, 2005 |
| Priority date | — |
| Expiry date | Mar 12, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device of the MCM type capable of high-speed operation and low power consumption and its manufacturing method are provided. A plurality of semiconductor chips, each having an internal circuit as well as an external connection circuit drawn from the internal circuit, are mounted on the same supporting substrate of this semiconductor device. Semiconductor chips are connected with each other, not by way of the external connection circuits, but directly at a portion between the internal circuits through wiring. This wiring is patterned on an insulating film provided on the supporting substrate and covers the semiconductor chips. Accordingly, through connection holes formed on the insulating film, connection can be established to the internal circuits or the wiring can be formed on the supporting substrate side. If the wiring is formed on the supporting substrate side, the semiconductor chips are to be mounted facing down relative to the supporting substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.