Patent · US Expired

Method for measuring product parameters of components formed on a wafer and device for performing the method

US6946864B2 · kind B2 · utility

20Cited by

7References

20Claims

0Family size

Assignee

OSRAM GmbH · DE

Inventors

Wolfgang Gramann · Regensburg, DE
Raimund Oberschmid · Sinzing, DE
Werner Spath · Holzkirchen, DE
Wolfgang Teich

Key dates

Filing date	Feb 19, 2002
Grant date	Sep 20, 2005
Priority date	—
Expiry date	Jul 1, 2023

Classification

Technology area (CPC G)Physics
CPC primaryG01N21/66
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A measuring arrangement for measuring product parameters of a component in the epitaxial layer (28) of a wafer comprises measuring probe (3) on whose contact side (23) a recess (24) is installed, into which an electrolyte can be poured. The electrolyte produces an electrical connection between a contact body (11), which is charged with a signal from a pulsed-current source, and the surface (22) of the wafer (2). A detector (16) serves for detecting the light which is emitted by the component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.