Thermal interface material
US6947285B2 · kind B2 · utility
36Cited by
19References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2003 |
| Grant date | Sep 20, 2005 |
| Priority date | — |
| Expiry date | Aug 25, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal interface material (40) includes a polymer matrix and a number of carbon nanocapsules incorporated in the polymer matrix. The thermal interface material is sandwiched between a heat source (30) having a high density and a heat sink (50). The thermal interface material can provide a maximum surface contact area and can increase thermal conductivity between the heat source and the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.