Ball grid array package with an electromagnetic shield connected directly to a printed circuit board
US6947295B2 · kind B2 · utility
63Cited by
12References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 20, 2004 |
| Grant date | Sep 20, 2005 |
| Priority date | — |
| Expiry date | Jan 20, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3436
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ball grid array package includes a chip having a substrate with a bottom surface, a plurality of solder bumps projecting outwardly from the bottom surface of the substrate, and an electromagnetic shield including a housing that defines an inner space which receives the chip and the solder bumps therein, and a bottom opening for access into the inner space. The solder bumps project outwardly of the inner space through the bottom opening in the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.