Package map data outputting circuit of semiconductor memory device and method for outputting package map data
US6947307B2 · kind B2 · utility
0Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2005 |
| Grant date | Sep 20, 2005 |
| Priority date | — |
| Expiry date | Jan 6, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C29/48
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A package map data outputting circuit of a semiconductor memory device embedded with a test circuit and a method for the same. In order to improve the reliability of package map data and easily output a greater amount of package map data, package map data is stored to package map data registers at the wafer level and then output through the test circuit at the package level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.