Centralized control architecture for a laser materials processing system
US6947802B2 · kind B2 · utility
33Cited by
91References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2003 |
| Grant date | Sep 20, 2005 |
| Priority date | — |
| Expiry date | May 13, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K37/0235
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus, systems, and methods for monitoring the processing of a workpiece that includes directing an incident laser beam onto the workpiece and using an optical detector for measuring a signal emitted from the workpiece as a result of the incident laser beam. The detector generates at least two signals based upon the optical signal. The method also involves use of a light source monitor in determining workpiece processing quality based upon the quotient of the two outputs as well as a magnitude of one of the two quotients.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.