Heat sink for an optical module
US6948861B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2001 |
| Grant date | Sep 27, 2005 |
| Priority date | — |
| Expiry date | May 2, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/42
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical module includes a base and a plurality of cooling fins mounted to the back surface of a printed wiring board used to support a number of opto-electronic devices. To optimize heat removal; the fins are mounted on the back surface in alignment with the opto-electronic devices mounted on the front surface. The module also includes a number of fiber-optic management features which are mounted on the wiring board or materially integrated with the base and cooling fins. By combining fiber-optic management features with a heat sink, on the opposite side of board-mounted opto-electronic components, the optical module achieves increased packaging density and functionality on a per volume basis compared with its conventional counterparts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.