Method for making resin bonded abrasive tools
US6949129B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 30, 2002 |
| Grant date | Sep 27, 2005 |
| Priority date | — |
| Expiry date | Apr 15, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01P2006/10
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method for producing organically bonded abrasive article includes combining an abrasive grain component and a phenol-based resin component. The combined components are molded and thermally cured in an atmosphere that comprises humidity, wherein the atmosphere contacts the molded components, thereby producing the organically bonded abrasive grain. The abrasive grain optionally can first be combined with an organosilicon compound, to form organosilicon-treated abrasive grain, and then with the phenol-based resin component. In one example, the phenol-based resin is thermally cured in the presence of steam. Abrasive articles produced by the method of the invention generally have improved properties under wet grinding conditions. In one example, an abrasive article produced by the method of the invention includes ammonia in an amount less than about 50 ppm. In another example, an abrasive grinding wheel produced by the method of the invention has a strength retention greater than about 57 percent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.