Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
US6949171B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 25, 2002 |
| Grant date | Sep 27, 2005 |
| Priority date | — |
| Expiry date | Mar 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/245
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention is a method of providing conductive tracks on a printed circuit including coating a substrate carrying printed tracks with an electro-plating solution with a tool which provides a first electrode of an electro-plating circuit and a second electrode provided by the tracks which are to be electroplated, and a tool suitable for use in electro-plating electrically conductive regions of a substrate, the tool including an absorptive member in which plating solution can be carried; a first electrode of an electro-plating circuit adapted to make electrical contact with plating solution carried by the absorptive member; and at least one tool second electrode electrically insulated from the first electrode and spaced from the absorptive member, the tool second electrode being so positioned that as the absorptive member is wiped across a surface of a substrate, the second electrode contactor can be wiped across the surface of the substrate to contact electrically conductive regions of the substrate to form a second electrode of the electro-plating circuit therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.