Arrangement enabling a liquid to flow evenly around a surface of a sample and use of said arrangement

US6949172B1 · kind B1 · utility

Assignee

• Tyco Electronics Logistics AG · CH

Inventors

• Daniel Hosten · Bochum, DE
• Helge Schmidt · Speyer, DE
• Michael Schwab · Markdorf, DE

Key dates

• Filing date: Aug 10, 2000
• Grant date: Sep 27, 2005
• Expiry date: Aug 10, 2020

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D17/001
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The invention relates to an arrangement enabling a liquid (2) to flow evenly around a surface of a sample (3); said arrangement has a flow chamber (1) through which a liquid (2) flows via inflow and outflow pipes (7, 8). The sample (3) can be rotated about an axis of rotation by means of a rotary drive (5). A filter (13) which extends crosswise to the direction of flow of the liquid (2) and which ensures a uniform flow through the inflow and outflow pipes (7, 8) is situated in front of the inflow and outflow pipes (7, 8). The arrangement is especially suitable for depositing a homogeneous layer of a nickel/iron alloy on a silicon wafer (3). The invention relates furthermore to the use of the arrangement.