Heat-transfer-stamp process for thermal imprint lithography
US6949199B1 · kind B1 · utility
90Cited by
13References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 5, 2002 |
| Grant date | Sep 27, 2005 |
| Priority date | — |
| Expiry date | Apr 29, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/887
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of performing thermal imprint lithography of a surface of a thermoplastic layer-coated workpiece for forming a pattern therein comprises pre-heating the workpiece to a pre-selected high temperature prior to inserting the workpiece in a stamping/imprinting tool maintained at a predetermined lower temperature, whereby the interval for thermal cycling of the stamping/imprinting tool between higher and lower temperatures is eliminated or at least reduced. Applications of the method include forming servo patterns in disk-shaped substrates for hard disk recording media.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.