High temperature stable adhesive
US6949306B2 · kind B2 · utility
1Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2002 |
| Grant date | Sep 27, 2005 |
| Priority date | — |
| Expiry date | Jul 30, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49114
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In order to provide a high temperature resistant adhesive based on water glass which is particularly suited for sticking metal substrates and which remains gas-tight and does not lose its electrical insulating properties even at high operational temperatures, it is proposed that the adhesive should comprise an additive in the form of boron nitride.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.