Method and apparatus for optically aligning integrated circuit devices
US6949406B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2004 |
| Grant date | Sep 27, 2005 |
| Priority date | — |
| Expiry date | Apr 22, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One embodiment of the present invention provides a system that facilitates aligning a first semiconductor die with a second semiconductor die, wherein the first semiconductor die and the second semiconductor die are arranged active face to active face. Note that the active face contains circuitry for communicating between semiconductor dies. The system starts by generating light on an active face of the first semiconductor die. The system then collimates the light within the active face of the first semiconductor die to form a first beam of light which is projected onto the second semiconductor die. Next, the system receives the first beam of light on an active face of the second semiconductor die and determines a position of the first beam of light on the active face of the second semiconductor die. Finally, the system determines an alignment of the second semiconductor die relative to the first semiconductor die based on the determined position of the first beam of light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.