High-frequency line
US6949444B2 · kind B2 · utility
4Cited by
15References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2002 |
| Grant date | Sep 27, 2005 |
| Priority date | — |
| Expiry date | Mar 1, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming at least one conductive line intended to receive high-frequency or high-value currents, formed above a given portion of a solid substrate outside of which are formed other elements, including the steps of digging at least one trench in the solid substrate; forming an insulating area in the trench; and forming said conductive line above the insulating area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.